Chicago (U.S.A.) from 8th to 11th November 2020
Join the digital event that allows to connect customers and manufacturers in a practical, active and immediate way.
Robopac, OCME and TopTier Palletizers will be together online to meet customers and visitors in our virtual booth, where experts will be at your complete disposal through Live Chats showing all the news over our range solutions.
Discover more about packexpoconnects and visit our virtualbooth :
For further informations: www.packexpointernational.com